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Back39-30-0020, 1 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header SMD 1x23 1.27mm single row Through hole angled pin header, 2x32, 2.54mm pitch, double rows Through hole pin header THT 2x07 2.00mm double row surface-mounted straight pin header, 1x11, 2.54mm pitch, double rows Through hole socket strip THT 2x25 2.54mm double row Through hole straight pin header, 2x25, 2.00mm pitch, 6.35mm socket length, single row Through hole straight pin header, 2x14, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x03 2.54mm double row Through hole straight socket strip, 2x24, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted pin header THT 1x26 2.54mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x39, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x23 2.54mm single row style2 pin1 right Through hole straight socket strip, 2x11, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight socket strip, 2x05, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x15 1.27mm double row surface-mounted straight socket strip, 2x17, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x06, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length, 1x09, 5.08mm pitch, single row style2 pin1 right Through.
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