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See http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.7mm MultiwattF-11 staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220-11, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-11, Horizontal, RM 2.54mm, staggered type-1 TO-220-11, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 2.54mm TO-251-2, Horizontal, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 0.9mm staggered type-1 TO-220F-9, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 10.9mm TO-247-3, Horizontal, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://www.analog.com.tw/pdf/All_In_One.pdf TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-127-02-xx-DV-TE, 27 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 12, Wuerth electronics 9774010943 (https://katalog.we-online.de/em/datasheet/9774010943.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2058, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3991, 39 Circuits (http://www.molex.com/pdm_docs/sd/5022503991_sd.pdf), generated with kicad-footprint-generator JST SHL series connector, 202396-1207 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator connector wire 0.1sqmm strain-relief Soldered wire connection, for 6 times 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 2mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times.

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