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And b/Images/PXL_20210831_000949090.jpg differ Binary files /dev/null and b/3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/HOLD PORTAL.png From dcaec240831d28b722a7d7988287c76a1461e439 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete 'Panels/futura light bt.ttf' Futura BT font files From f707877a83c92d22bdfed3b6bc7a14bba9e25bab Mon Sep 17 00:00:00 2001 Subject: [PATCH] Build images Images/PXL_20210831_000922493.jpg | Bin 11916 -> 0 bytes Notes: Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel power jack 2mm 2.5mm KLDX-0202-BC KLDX-0202-AC 1.10mm Pitch microSD Card Connector, Normal Type, Outer Tail, Without Ejector (https://global.kyocera.com/prdct/electro/product/pdf/5638.pdf SD card connector, top mount, SMT (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F2041021%7FB%7Fpdf%7FEnglish%7FENG_CD_2041021_B_C_2041021_B.pdf%7F2041021-4 Micro SD, SMD, right-angle, push-pull (https://media.digikey.com/PDF/Data%20Sheets/Hirose%20PDFs/DM3D-SF.pdf 1.10mm Pitch microSD Memory Card Connector, Reverse Type, Outer Tail, Without Ejector (https://global.kyocera.com/prdct/electro/product/pdf/5638.pdf SD Card Connector, Surface Mount, ZIF, 15 Circuits (https://www.molex.com/pdm_docs/sd/5022311500_sd.pdf molex FFC/FPC connector Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST.

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