Labels Milestones
BackFF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header, 1x36, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x38 1.00mm double row Through hole straight pin header, 2x30, 2.54mm pitch, 8.51mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight pin header, 2x14, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 1x17 1.00mm single row style1 pin1 left Surface mounted pin header THT 2x31 2.54mm double row Through hole angled socket strip THT 1x02 1.00mm single row Through hole angled pin header THT 2x13 2.54mm double row Through hole angled pin header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x39, 2.00mm pitch, single row Through hole IDC header, 2x30.
- Integrations E Package eSIP-7F Flat Package.
- (https://katalog.we-online.de/em/datasheet/9774090960.pdf,), generated with kicad-footprint-generator.