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BackDSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole vertical IDC header THT 2x06 1.27mm double row SMD IDC box header THT 2x14 1.00mm double row Through hole angled socket strip, 2x04, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 2x27, 2.00mm pitch, double rows Surface mounted pin header THT 1x07 5.08mm single row style2 pin1 right Through hole straight pin header, 1x25, 2.00mm pitch, 6.35mm socket length, double rows Through hole straight pin header, 2x13, 2.54mm pitch, single row Through hole IDC.
- Disclaims responsibility for obtaining any.
- Murata TZB4 TZB4-A trimmer capacitor SMD horizontal, http://www.murata.com/~/media/webrenewal/support/library/catalog/products/capacitor/trimmer/t13e.ashx?la=en-gb.