Labels Milestones
BackBGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole socket strip SMD 1x33 1.27mm single row style2 pin1 right Through hole pin header SMD 1x16 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x08 2.00mm double row Through hole angled pin header, 1x38, 1.00mm pitch, 2.0mm pin length, single row Through hole angled pin header THT.
- -9.5392e-07 vertex -6.92909 2.87011 6.0001 vertex 5.30329 5.30329.
- abc39a50d6580d276015bcd974580f199a987534 Delete '3D.
- Wire Pad, Square, SMD Pad.