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B/Images/adsr.png differ Binary files /dev/null and b/Docs/precadsr_layout_front.pdf differ Tayda 6096366E - 2 5mm LEDs - one per step // 1 for 5v / 2.5v output mode // 10 LEDs 3 sockets 6 sockets Potentiometers: One potentiometer for internal clock rate. Switches: Momentary-normal-off pushbutton to manually reset. LEDs: One per step, to indicate current step. (10 - CLOCK in - glide in (sleeve and normal both GND 6x Sockets, 2pin: Gate out (could normal to TP10, optional 2x Toggle Switches, 2pin: all step switches (all go to same bus 2x Pushbutton switches, all 2pin: reset Pots, 3-pin: Glide attenuator (B10k) (join two left pins from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below) Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below) Pots, 2-pin: Glide, manual (A100k) (two left pins, from below - Clock rate (B100k) (not sure yet which 2 pins diameter 5.0mm z-position of LED center 3.0mm, 3 pins, pitch 2.5mm, size 9.7x10mm^2, drill diamater 1.2mm, pad diameter 3mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose series connector, 502585-1270 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0102, With thermal vias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/60001477A.pdf (page 1083)), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-07P-1.25DS, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B22B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator JST GH series connector, B9B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.1 mm² wires, basic insulation, conductor diameter 2mm, outer diameter.

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