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Infineon, PG-TISON-8-5, 8x8x1.1mm, 1mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-5/ VML0806, Rohm (http://rohmfs.rohm.com/en/techdata_basic/transistor/soldering_condition/VML0806_Soldering_Condition.pdf, http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf MicroCrystal C3 2.5x3.7mm, https://www.microcrystal.com/fileadmin/Media/Products/RTC/Datasheet/RV-1805-C3.pdf SON, 8 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Thin Shrink Small Outline (SM) - 5.28 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 5x-dip-switch SPST , Slide, row.

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