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ROHM MNR12 (see mnr_g.pdf Chip Resistor Network, ROHM MNR02 (see mnr_g.pdf Chip Resistor Network, ROHM MNR12 (see mnr_g.pdf SMT resistor net, Bourns CAT16 series, 2 way SMT resistor net, Bourns CAT16 series 4 way SMT resistor net, Bourns CAT16 series 2 way SMT resistor net Bourns CAT16 series 4 way 3mm PhotoDiode, plastic SMD DIL PhotoDiode, plastic DIL, 4.3x4.65mm², RM5.08 PhotoDiode plastic SMD SmatDIL PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for diode bridges, row spacing 7.62 mm (300 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 3x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil reed relay Standex-Meder SIL-relais, UMS, see http://cdn-reichelt.de/documents/datenblatt/C300/UMS05_1A80_75L_DB.pdf Resistor SMD 4020 (10251 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-T (3528-12 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, 14111213002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5030, 3 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package - 10x10x0.9 mm Body [TQFP] With Exposed Pad Variation BB; (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CN (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin.

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