Labels Milestones
BackGrid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole pin header THT 2x20 2.54mm double row Through hole horizontal IDC box header, 2x13, 1.00mm pitch, single row Surface mounted pin header THT 2x28 1.00mm double row surface-mounted straight socket strip, 2x01, 2.00mm pitch.
- 1.36x1.86mm, 10 bump 3x4 (perimeter) array.
- "B.Fab" user (49 "F.Fab" user (aux_axis_origin 0 200.
- Vertex 5.7853 -4.29641 7.81019 facet.
- Vertex 4.77144 4.18796 7.82405 facet.