3
1
Back

Pitch, 3.9x4.9mm body, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-06A1, example for new part number: A-41792-0011 example for new part number: 26-60-5140, 14 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049CH.pdf SC-74, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant BA), generated with kicad-footprint-generator ipc_noLead_generator.py LQFN, 10 Pin (https://fscdn.rohm.com/en/techdata_basic/ic/package/Jisso_MLGA010V020A-1-2_Rev005s_E2(MSL3).pdf ST HLGA, 10 Pin.

New Pull Request