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Size 5.54x6.2mm^2, drill diamater 1.3mm, pad diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix PTSM-0,5-5-2.5-H-THR pitch 2.5mm size 20.5x5mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix MKDS-3-6-5.08 pitch 5.08mm size 45.7x10.6mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00287, 2 pins, pitch 5mm, size 35x8.1mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-105 45Degree pitch 5mm size 20x7.6mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-405 45Degree pitch 10mm size 75x8.1mm^2 drill 1.3mm pad 2.5mm terminal block connector http://www.phoenixcontact.com/us/products/1778748/pdf PhoenixContact PTSM0,5 3 2,5mm vertical SMD spring clamp terminal block RND 205-00082 vertical pitch 5mm size 32.3x14mm^2 drill 1.15mm pad 3mm Terminal Block Phoenix PT-1,5-8-3.5-H, 8 pins, pitch 5mm, size 50x9.8mm^2, drill diamater 1.15mm, pad diameter 2.7mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2021, 2 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 44 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S_Wide package, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 8 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm LFCSP, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13), generated with kicad-footprint-generator Molex CLIK-Mate series connector, LY20-12P-DT1, 6 Circuits (https://www.molex.com/pdm_docs/sd/2005280060_sd.pdf), generated with kicad-footprint-generator connector wire 0.127sqmm strain-relief Soldered wire connection with double feed through strain relief, for 5 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PHD series connector, B13B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated.

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