Labels Milestones
BackZIF 10.16mm 400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232.
- 4.9 milli Ohm (http://http://www.vishay.com/docs/30108/wsk.pdf Shunt Resistor.
- CL535-0414-1-51, 14 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf.
- HLE-147-02-xxx-DV, 47 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated.