Labels Milestones
BackST WLCSP-90, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch.
- 0.297017 0.923202 vertex 7.45476 5.03481 3.82299 facet.
- Order numbers 0031.3551 and 0031.3558 (https://www.schurter.com/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_FAB.pdf.