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Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 40-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 42-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 42-pin zero insertion force socket, through-hole, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST Slide 8.61mm 338mil SMD SMD 10x-dip-switch SPST Copal_CHS-10A, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 10-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Small Outline (SS)-5.30 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 24 Pin (JEDEC MO-194 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0410, with PCB locator, 6 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for.

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