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PTSM0,5 7 HV 2,5mm vertical SMD spring clamp terminal block connector http://www.phoenixcontact.com/us/products/1814757/pdf PhoenixContact PTSM0.5 5 2.5mm vertical SMD spring clamp terminal block connector http://www.phoenixcontact.com/us/products/1778751/pdf terminal block RND 205-00064 45Degree pitch 5mm size 7.3x14mm^2 drill 1.15mm pad 3mm Terminal Block Phoenix MPT-0,5-4-2.54, 4 pins, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Sxx-0.1.pdf dc-dc recom buck sip-4 pitch 2.54mm size 15.7x6.5mm^2 drill 1.1mm pad 2.1mm Terminal Block Phoenix PTSM-0,5-7-2.5-H-THR pitch 2.5mm size 20.5x5mm^2 drill 1.2mm pad 3mm Terminal Block 4Ucon ItemNo. 10701 vertical pitch 5mm Varistor, diameter 12mm, width 5.8mm, pitch 7.5mm Varistor, diameter 7mm, width 3.4mm, pitch 5mm size 6.5x15mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 236-148, 45Degree (cable under 45degree), 6 pins, pitch 5mm, size 45x8.1mm^2, drill diamater 1.3mm, pad diameter 3.2mm, see http://www.metz-connect.com/de/system/files/METZ_CONNECT_U_Contact_Katalog_Anschlusssysteme_fuer_Leiterplatten_DE_31_07_2017_OFF_024803.pdf?language=en page 131, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-3-6-5.08 pitch 5.08mm size 35.6x10.6mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type067_RT01905HDWC, 5 pins, pitch 5mm, size 15x8.1mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MPT-0,5-10-2.54, 10 pins, pitch 10mm, size 25x8.1mm^2, drill diamater 1.3mm, pad diameter 2.7mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.36x1.86mm.

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