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Plastic Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of MSOP-16 (see https://www.analog.com/media/en/technical-documentation/data-sheets/3748fb.pdf MFSOP 4 pin straight chassis connector http://www.te.com/usa-en/product-1-1478204-0.html BNC female PCB.

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