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Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 5.08mm 2.54 4-lead dip package for Everlight ITR8307 with PCB locator, 3 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.75.

• 1843716 8A 160V Generic Phoenix Contact connector footprint.
• Normal 0.952375 0.288902 0.0975576 vertex -3.38578.
• 0.596366 -6.43809 7.83604 facet normal -0.115797.
• 6.23601 4.16677 6.0001 vertex -6.23601.
• 0.586836 facet normal 0.257143 0.137446 0.956549.

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