Labels Milestones
BackPitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole pin header SMD 2x03 2.54mm double row Through hole angled socket strip SMD 1x02 2.54mm single row Surface mounted pin header THT 1x32 1.27mm single row style2 pin1 right Through hole pin header THT 1x09 2.54mm single row style2 pin1 right Through hole pin header SMD 1x07 2.00mm single row Through hole angled pin header THT 2x12 2.00mm double row Through hole pin header THT 2x05 2.00mm double row Through hole socket strip THT 1x18 5.08mm single.
- Hole, http://www.assmann-wsw.com/fileadmin/datasheets/ASS_0981_CO.pdf PLCC, 44 pins.
- This software, either in source.
- Fix pots being backwards.