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ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST KingTek_DSHP07TS, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 10.8x4.1mm DIP Switch SPST Slide 8.9mm 350mil SMD 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row.

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