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SOIC 2.54 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package.

• 19 ckt, right angle 3mm lightpipe dual tower.
• File Images/PXL_20210831_002553634.jpg Normal file Unescape Schematics/Unseen Servant/Unseen.

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