3
1
Back

Handsoldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-R (2012-12 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 64-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TSSOP HTSSOP 0.65 thermal pad with vias HTSSOP, 20 Pin (https://resurgentsemi.com/wp-content/uploads/2018/09/MPR121_rev5-Resurgent.pdf?d453f8&d453f8), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 2.5, Wuerth electronics 9774050360 (https://katalog.we-online.de/em/datasheet/9774050360.pdf), generated with kicad-footprint-generator JST SHL series connector, S12B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Hirose DF12C.

New Pull Request