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Back| 100nF | Ceramic capacitor | | | U1 | 1 C10, C14 too small for a single 0.5 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST ZE series connector, S7B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 160 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-80DP-0.5V, 80 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN6 3*3 MM, 0.95 PITCH; http://www.ti.com/lit/ds/symlink/lmr62421.pdf 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [QFN] with thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf), generated with kicad-footprint-generator JST EH series connector, B02B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 8 Pin (JEDEC MO-153 Var GD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with.