Labels Milestones
BackLength*width=26.5*11.5mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 20.32mm length 12.8mm diameter 5.8mm Fastron HBCC Inductor, Axial series, Axial, Vertical, pin pitch=7.62mm, , length*diameter=3.04*1.6mm^2, , https://www.nxp.com/docs/en/data-sheet/KTY83_SER.pdf Diode DO-34_SOD68 series Axial Vertical pin pitch 10.00mm diameter 35mm height 50mm Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=15.24mm, , length*diameter=9.5*4mm^2, Fastron, SMCC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_SMCC_NEU.pdf, http://cdn-reichelt.de/documents/datenblatt/B400/LEADEDINDUCTORS.pdf Inductor Axial series Axial Horizontal pin pitch 10.00mm diameter 30mm height 45mm Electrolytic Capacitor CP, Radial_Tantal series, Radial, pin pitch=7.50mm, , length*width=9*8.5mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 25.4mm 2W length 11.9mm diameter 4.5mm Fastron MECC Inductor, Axial series, Axial, Horizontal, pin pitch=43mm, , length*diameter=37*20mm^2, Electrolytic Capacitor, , http://www.vishay.com/docs/28342/058059pll-si.pdf CP Radial series Radial pin pitch 17.5mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Sharp OPIC IS485 IS486 package for diode bridges, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 14-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils.
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