Labels Milestones

Back

ZIF 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils.

• 0.831467 -2.90246e-08 vertex 1.52047 -3.02412 6.59.
• Normal 0.55473 0.0546198 0.830236 vertex -0.183929 9.12468 3.76384.
• SMD, DF12E3.0-32DP-0.5V, 32 Pins.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects