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BackModule 16-pin module, column spacing 22.86 mm (900 mils), Socket THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package with missing.
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- -9.578366e+01 9.188900e+01 1.055000e+01 facet normal 3.934383e-001 -6.745008e-001.