Labels Milestones
BackConnector, 502443-1470 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-30DS-0.5V, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0930, 9 Pins per row (http://www.molex.com/pdm_docs/sd/1053101208_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 28 Pin (http://www.issi.com/WW/pdf/31FL3731.pdf#page=21), generated with kicad-footprint-generator Molex Pico-Lock horizontal Molex MicroClasp Wire-to-Board System, 55935-0230, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-149-02-xxx-DV-LC, 49 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf TDFN, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA), generated with kicad-footprint-generator JST GH series connector, 502494-0270 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xxx-DV-BE-A, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XA series connector, S12B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 24 leads; body width 3 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 5.08mm TO-220F-3, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 1.7mm staggered type-1 TO-220F-15, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 10.9mm TO-247-2, Vertical, RM 5.08mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220F-5 Vertical RM 1.27mm staggered type-1 TO-220-7 Vertical RM 1.7mm MultiwattF-11 staggered type-1 TO-220-11, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 5.45mm TO-247-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220F-11, Vertical, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.27mm staggered type-1 TO-220-4 Vertical RM 2.54mm TO-220-4, Horizontal, RM 1.27mm, staggered type-1 TO-220-7 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220F-5 Vertical RM 1.27mm staggered type-1 TO-220-4 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-11, Horizontal, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220-9.
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