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TE, 1-826576-7, 17 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.127 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Diode SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: https://www.vishay.com/docs/30100/wsl.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0630, 6 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator JST SH series connector, B08B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Hirose DF11 through.

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