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Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf.

• Definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8.
• 6x5, 0.5P; CASE 505AB (see ON Semiconductor 122BX.PDF.
• Tweaks before fabbing; Kosmo_panel lib update Change.
• -0.727323 0.241721 0.642318 facet normal 0.028588 -0.0942416 0.995139.
• Vertex 2.10997 8.94883 7.89406.

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