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Number: 1803471 8A 160V Generic Phoenix Contact connector footprint for: GMSTB_2,5/5-GF-7,62; number of pins: 11; pin pitch: 7.62mm; Vertical; threaded flange || order number: 1828003 8A 160V Generic Phoenix Contact connector footprint for: GMSTB_2,5/12-GF-7,62; number of pins: 11; pin pitch: 3.50mm; Angled || order number: 1924321 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/10-GF-5.08; number of pins: 07; pin pitch: 5.08mm; Angled || order number: 1843321 8A 160V Generic Phoenix Contact connector footprint for: MSTBA_2,5/11-G; number of pins: 09; pin pitch: 5.00mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1755516 12A || order number: 1923788 16A (HC Generic Phoenix Contact connector footprint for: MSTBV_2,5/16-GF-5,08; number of pins: 06; pin pitch: 7.62mm; Angled || order number: 1755503 12A || order number: 1776618 12A Generic Phoenix Contact connector footprint for: MSTBV_2,5/16-GF-5,08; number of pins: 07; pin pitch: 5.00mm; Vertical || order number: 1924305 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/15-GF-3.81; number of steps (sw11 // step rotary switch - 9.5mm, +5mm extra space available mini toggle switch ON-ON | | C10 | 3 | AudioJack2 | Audio Jack, 2 x 6mm drills 3 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch Vertical 2-215079-0 9-215079-20 TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 16 pin with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CE.PDF DD Package; 14-Lead Plastic Dual Flat, No Lead Package - 10x10x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 44 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 56 leads; body width 6.1 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 14 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP.

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