Labels Milestones
BackThermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.5mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf QFN, 48 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/48L_VQFN_6x6mm_6LX_C04-00494a.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_24_7.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 1.5/12-H-3.5 1990834 Connector Phoenix Contact connector footprint for: MSTBV_2,5/16-GF-5,08; number of pins: 04; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1924444 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/7-GF-3.5; number of pins: 05; pin pitch: 5.00mm; Angled || order number: 1776838 12A solder Pin_ loose fit solder Pin_ with flat with hole, hole diameter 1.0mm wire loop with bead as test point, pitch 5.08mm, size 20.3x9.8mm^2, drill diamater 1.15mm, pad diameter 2.5mm, hole diameter 1.3mm, length 11.3mm, width 2.8mm Capacitor C, Radial series, Radial, pin pitch=5.00mm, , diameter=10.0mm, Neosid, SD12k, style1, http://www.neosid.de/produktblaetter/neosid_Festinduktivitaet_Sd12k.pdf Inductor Radial series Radial pin pitch 7.50mm diameter 17mm Electrolytic Capacitor CP Radial series Radial pin pitch 5.08mm length 9.5mm diameter 5.2mm Diode, DO-201AE series, Axial, Horizontal, pin pitch=15.24mm, , length*diameter=9.5*5.2mm^2, , http://www.diodes.com/_files/packages/DO-201AD.pdf Diode DO-201AD series Axial Horizontal pin pitch 5.00mm diameter 7.5mm Fastron XHBCC Inductor, Axial series, Axial, Vertical, pin pitch=5.08mm, , length*diameter=16*6.3mm^2, Fastron, VHBCC, http://www.fastrongroup.com/image-show/25/VHBCC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Horizontal pin pitch 7.50mm length 9mm width 7.7mm Capacitor C, Rect series, Radial, pin pitch=12.70mm, , length*width=41.91*17.78mm^2, Pulse, F, http://datasheet.octopart.com/PE-92112KNL-Pulse-datasheet-17853305.pdf L_Toroid Vertical series Radial pin pitch 15.24*22.86mm^2 length 34.29mm width 20.32mm Bourns 8100 3 Phase, CM Choke, https://vacuumschmelze.com/03_Documents/Datasheets%20-%20Drawings/Commom-Mode-Chokes/6123-X240.pdf Wuerth, WE-CMB, Bauform S, Wuerth, WE-CMB, Bauform L, Wuerth, WE-CMB, Bauform XS, Wuerth, WE-CMB, Bauform L, Wuerth, WE-CMB, Bauform XL, Wuerth, WE-CMB, Bauform XS, Wuerth, WE-CMB, Bauform XL, Wuerth, WE-CMB, Bauform M, Wuerth, WE-CMB, Bauform M, Wuerth, WE-CMB, Bauform XXL, Lodestone Pacific, vertical toroid mount, 16AWG/1.27mm holes, http://www.lodestonepacific.com/CatKpdf/VTM_Series.pdf Lodestone Pacific, 30.48mm diameter vertical toroid.
New Pull Request