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Back0d3d72c49e Use THT electrolytics, finish SMT layout, try on quentin font for size Compare 2 commits » created pull request synth_mages/MK_VCO#5 Final revision; added custom DRC as project file (pts Final revision; added custom DRC as project file tstamp 52a45927-621d-4774-9080-e26ba88e3d95) Final revision; added custom DRC as project file tstamp 6b7d6cc6-a11c-4566-a5f2-ddde4d827642) Final revision; added custom DRC as project file new_footprints Added hard sync to schematic, laid out PCB with on-board components Add correct footprints to fireball Merge pull request synth_mages/MK_VCO#4 24955050f1 Merge pull request 'new_footprints' (#5) from new_footprints into main v1 Final tweaks, version submitted to JLCPCB on 20240124 3d279dd88c Finish schematic, add PDF 2d3c489f2a More SR1 notation main master PSU/Synth Mages Power Word Stun.kicad_sch | 1943 40 Dwgs.User user hide From 5a4d5850276107dae545a96ba13aec19af1bdbba Mon Sep 17 00:00:00 2001 Subject: [PATCH] Finish schematic, add PDF Fix for component clearance, panel thickness from printer realities Fix for component clearance, panel thickness from printer realities main synth_tools/Schematics/SynthMages.pretty/Switch.dcm 352 lines main synth_tools/Panels/Futura Heavy BT.ttf differ From d74befe391233bd8b162f7f5705c277e04d9b135 Mon Sep 17 00:00:00 2001 Subject: [PATCH] drugs & wires, pilotside drugs & wires, pilotside From bab77fac9dc44b0a10d743c564c65ae0938027f6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] updated README.md updated README.md updated C14 footprint, traces, groundplane 2cbdb94ba9 updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and thermal vias; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm.
- JEDEC MO-220 variant VEED-6), generated with kicad-footprint-generator.
- Length 7.5mm width 5.0mm Capacitor C, Rect series.
- Layout and panel are Kosmo format. The present.
- DEF MountingHole H 0 40.
- Pitch=7.62mm, 15W, length*width*height=48*12.5*12.5mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf.