synth_tools

Back

Definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, QFM MOF0009A, 6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf QFN, 41 Pin (http://www.ti.com/lit/ml/mpqf506/mpqf506.pdf QFN, 28 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081926_0_UDE28.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-114-02-xxx-DV-BE-LC, 14 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-36DS-0.5V, 36 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-04A, example for new mpn: 39-28-x18x, 9 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-24A1, example for new part number: A-41791-0011 example for new mpn: 39-28-924x, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV-BE-LC, 30 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3)), generated with kicad-footprint-generator ipc_noLead_generator.py WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD.

New Pull Request

Labels Milestones