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Https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.9x1.4mm, 6.

• 19.1916 facet normal -0.816128 -0.545352 -0.191121 facet normal.
• 40-lead though-hole mounted DIP package, row.
• -1.000000e+00 -2.393491e-15 facet normal -0.184688 0.608831 0.771502 vertex.

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