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(5mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x40, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x36 2.54mm single row Through hole IDC header, 2x13, 2.54mm pitch, double rows Surface mounted pin header THT 1x39 1.00mm single row style2 pin1.

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