synth_tools

Back

A Circular Fiducial, 1.5mm bare copper, 3mm soldermask opening Circular Fiducial, 1.5mm bare copper, 3mm soldermask opening (Level B Circular Fiducial, 1.5mm bare copper, 1mm soldermask opening (Level B Circular Fiducial, 1.5mm bare copper, 1mm soldermask opening Circular Fiducial, 0.75mm bare copper, 1.5mm soldermask opening Circular Fiducial, 0.5mm bare copper, 1.5mm soldermask opening Circular Fiducial, 1.5mm bare copper, 4.5mm soldermask opening Circular Fiducial, 1mm bare copper, 2.25mm soldermask opening Circular Fiducial, 1mm bare copper, 2.25mm soldermask opening (Level C Circular Fiducial, 1.5mm bare copper, 3mm soldermask opening Circular Fiducial, 1mm bare copper, 1mm soldermask opening Circular Fiducial, 1.5mm bare copper, 1mm soldermask opening Circular Fiducial, 0.5mm bare copper, 4.5mm soldermask opening Circular Fiducial, 1.5mm bare copper, 2mm soldermask opening (Level A Circular Fiducial, 0.5mm bare copper, 1mm soldermask opening (recommended 5-pin SAW filter package, https://www.golledge.com/media/3785/mp08167.pdf 8-pin 3.8x3.8mm SAW filter, https://www.golledge.com/media/1831/ma05497.pdf Compact PCB mounting EMI filter (https://www.schaffner.com/de/produkte/download/product/datasheet/fn-405-pcb-mounting-filter/ Ultra Compact EMC Filter (https://www.schaffner.com/products/download/product/datasheet/fn-406-ultra-compact-emc-filter/ Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.megastar.com/products/fusetronic/polyswitch/PDF/smd2920.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44: plastic thin shrink small outline package; 8 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.nxp.com/docs/en/package-information/SOT457.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-5040, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 1 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 2mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ltc2358-16.pdf), generated with kicad-footprint-generator connector TE 826576 vertical TE, 1-826576-5, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 502382-0470 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 84 pins, surface mount PLCC, 20 pins, dual row male, vertical entry Harwin LTek Connector, 6 pins, pitch 5.08mm, size 30.5x8.45mm^2, drill diamater 1.1mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 6-pin TSOT23 package, http://www.analog.com.tw/pdf/All_In_One.pdf TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF.

New Pull Request

Labels Milestones