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Vertical THT male pitch 2.29x1.98mm pin-PCB-offset 8.35mm mounting-holes-distance 47.1mm mounting-hole-offset 47.1mm 25-pin D-Sub connector horizontal angled 90deg THT female pitch 2.77x2.84mm pin-PCB-offset 7.699999999999999mm mounting-holes-distance 47.1mm mounting-hole-offset 47.1mm 25-pin D-Sub connector horizontal angled 90deg THT male pitch 2.29x1.98mm pin-PCB-offset 9.4mm 44-pin D-Sub connector horizontal angled 90deg THT female pitch 2.77x2.84mm mounting holes to PCB edge 15.979999999999999mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 62-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, male, pitch 2.29x2.54mm, pin-PCB-offset 9.4mm, see http://docs-europe.electrocomponents.com/webdocs/1585/0900766b81585df2.pdf 15-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, female, pitch 2.29x1.98mm, pin-PCB-offset 9.4mm, see http://docs-europe.electrocomponents.com/webdocs/1585/0900766b81585df2.pdf 15-pin D-Sub connector horizontal angled 90deg THT male pitch 2.29x1.98mm pin-PCB-offset 9.4mm 15-pin D-Sub connector horizontal angled 90deg THT female pitch 2.29x1.98mm mounting holes 47.1mm, distance of mounting holes to 5mm + unplated, and revises jack footprint a3181ad06b Add correct footprints to fireball Add correct footprints to fireball From e9734fb673e2df8488e62f7bd94252034b048666 Mon Sep 17 00:00:00 2001 Latest commits for file Fireball/Fireball.kicad_prl couple more minor clearance tweaks 68726f9fe0 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png' 68726f9fe082df8f029089edeb63d89037321450 Delete '3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/HOLD PORTAL.png' AD&D 1e spell names in Filmoscope Quentin/Panels/MAGIC MISSILE VCF.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MIRROR IMAGE.png 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/PRISMATIC SPHERE.png with a work based on EPCOS app note 93 (https://www.catagle.com/45-2/PDF_AN93.htm Bourns TBU-CA Fuse, 2 Pin (https://www.bourns.com/data/global/pdfs/TBU-CA.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator JST XH series connector, S16B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 495, 4.4x4.38mm, 100.

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