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SmallPads 40-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, though-hole, row spacing 5.9 mm (232 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89006xx, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XA series connector, SM11B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-06A example for new mpn: 39-30-0160, 8 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator JST EH series connector, 505405-1070 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 505405-1370 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1410, with PCB locator, 2 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Molex LY 20 series connector, 505405-0470 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter.

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