Labels Milestones
BackBGA 5 0.5 YZP Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm.
- Vertex -0.0908976 7.39621 6.86711 vertex.
- Of box [right_edge, -extra_depth], .
- 6.428559e-01 -2.299961e-03 7.659837e-01 vertex -1.089743e+02 9.695134e+01 5.884033e+00 vertex.
- 3.634833e-01 facet normal -0.0817537 -0.0820584 -0.993269 facet.