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Mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm.

• Normal -9.534226e-01 -3.016377e-01 7.837633e-06 facet normal.
• -4.87024 -3.18104 21.335 facet normal.
• Annular, M8 mounting hole 2.7mm m2.5 Mounting Hole.

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