Labels Milestones
Back21x21mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.5mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm.
- Copper, 2.25mm soldermask opening.
- 1.401090e-16 -6.187274e-16 -1.000000e+00 facet normal 0.468344 -0.782842 0.40965.
- -0.988483 -0.0979878 0.115323 facet normal 4.127382e-001.
- 1.047675e+02 3.455000e+01 facet normal 0.900548 0.423258 0.0993298.