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9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x19, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole angled pin header SMD 1x19 2.00mm single row style2 pin1 right Through hole pin header SMD 2x36 1.00mm double row surface-mounted straight pin header, 2x25, 1.27mm pitch, double rows Through hole angled pin header THT 2x16 1.27mm double row surface-mounted straight socket strip, 2x31, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight pin header, 1x38, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x12, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x16, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x35, 2.54mm pitch, 6mm pin length, single row (from Kicad 4.0.7.

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