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(https://www.molex.com/pdm_docs/sd/2005280040_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py Plastic Small Outline (SS)-5.30 mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size 10.8x21.88mm 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package for diode bridges, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 7x-dip-switch SPST KingTek_DSHP07TS, Slide, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 16-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing.

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