Labels Milestones
Back0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x32, 1.27mm pitch, single row style2 pin1 right Through hole IDC header, 2x32, 2.54mm.
- 2.438923e-03 6.455765e-01 vertex -1.046252e+02 9.665134e+01 9.572266e+00.
- 0.194125 -4.03034e-07 vertex -3.16791 -1.29249.