3
1
Back

Pitch, 3.9x4.9mm body, exposed pad, thermal vias in pads, 5 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Hirose series connector, S02B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 16.

New Pull Request