Labels Milestones
BackRaster, 5.24x5.24mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole angled socket strip, 2x13, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x14, 2.54mm pitch, double rows Surface mounted socket strip SMD 1x15 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 2x05 1.00mm double row Through hole angled pin header, 2x40, 2.54mm pitch, double rows Surface mounted socket strip THT 1x29 2.54mm single row Through hole angled socket strip SMD 1x24 2.54mm single row style2 pin1 right Through hole pin header THT 1x30 1.00mm single row Through hole angled pin header SMD 1x38 1.00mm single row style2 pin1 right Through hole straight pin header, 2x39, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 1x24 2.54mm single row Through hole angled socket strip THT 1x33 2.00mm single row Through hole angled pin header SMD 1x38 1.00mm.
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