3
1
Back

Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments BGA-289, 0.4mm pad, based on EPCOS app note 93 (https://www.catagle.com/45-2/PDF_AN93.htm Bourns TBU-CA Fuse, 2 Pin (https://www.bourns.com/data/global/pdfs/TBU-CA.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 2.5, Wuerth electronics 9775086360 (https://katalog.we-online.com/em/datasheet/9775086360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (JEDEC MO-194 Var BB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP.

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