Labels Milestones
BackFHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole straight pin header, 1x24, 2.00mm pitch, 4.2mm pin length, single row style2 pin1 right Through hole straight pin header, 1x12, 1.00mm pitch, 2.0mm pin length, single row Through hole straight socket strip, 1x01, 1.27mm pitch, double rows Through hole straight socket strip, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled socket strip THT 1x13 2.54mm single row Surface mounted pin header THT 1x16 1.00mm single row Through hole straight pin header, 1x29, 2.54mm pitch, single row Through hole angled socket strip, 1x21, 2.00mm pitch, double rows Through hole IDC box header THT 2x04 2.54mm double row Through hole angled pin header THT 1x23 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x07 1.27mm single row Surface mounted pin header SMD 1x29 2.54mm single row style1 pin1 left Surface mounted pin header SMD 2x18 1.27mm double row surface-mounted straight socket strip.