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Connector, B10B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xx-DV-TE, 13 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 2, Wuerth electronics 9775031360 (https://katalog.we-online.com/em/datasheet/9775031360.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-S (3216-12 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.5 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.15 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Pico-Clasp series connector, B14B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD Sub-miniature slide switch, vertical, SMT J bend https://dznh3ojzb2azq.cloudfront.net/products/Slide/JS/documents/datasheet.pdf MEC 5G single pole normally-open illuminated tactile switch 6mm ALPS SKHH right angle Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact.

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