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TE, 1-826576-3, 13 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-1221 (alternative finishes: 43045-042x), 2 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator TE, 2-826576-0, 20 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP56: plastic thin shrink small outline package; 56 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py Analog LFCSP-UQ, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 9)), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 44 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm.

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